Products › SMD Resistors › Thick Film Chip Resistors

Thick Film Chip Resistors
- Compact, lightweight
- High stability & reliability
- Tolerance: ±1%, ±2%, ±5%
Dimensions & Specifications

Product Specifications
| Size | 0402 | 0603 | 0805 | 1206 | 1210 | 2010 | 2512 |
|---|---|---|---|---|---|---|---|
| Rated Power | 1/16W | 1/10W | 1/8W | 1/4W | 1/3W | 1/2W | 1W |
| Range ±1% | 100Ω–100kΩ | 10Ω–1MΩ | 10Ω–1MΩ | 10Ω–1MΩ | 10Ω–1MΩ | 10Ω–1MΩ | 10Ω–1MΩ |
| Range ±5% | 10Ω–1MΩ | 1Ω–10MΩ | 1Ω–10MΩ | 1Ω–10MΩ | 1Ω–10MΩ | 1Ω–10MΩ | 1Ω–10MΩ |
| Max. Working Voltage | 50V | 50V | 150V | 200V | 200V | 200V | 200V |
| Max. Overload Voltage | 100V | 100V | 300V | 400V | 400V | 400V | 400V |
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Dimensions
| Code | 0402 | 0603 | 0805 | 1206 | 1210 | 2010 | 2512 |
|---|---|---|---|---|---|---|---|
| L | 1.0±0.1 | 1.6±0.1 | 2.0±0.15 | 3.1±0.1 | 3.1±0.1 | 5.0±0.15 | 6.4±0.2 |
| W | 0.5±0.15 | 0.8±0.15 | 1.25±0.15 | 1.6±0.15 | 2.6±0.15 | 2.5±0.15 | 3.2±0.15 |
| H | 0.35±0.1 | 0.45±0.1 | 0.55±0.1 | 0.55±0.1 | 0.55±0.1 | 0.55±0.1 | 0.55±0.1 |
| T | 0.2±0.2 | 0.3±0.2 | 0.4±0.2 | 0.5±0.2 | 0.5±0.2 | 1.0±0.2 | 1.3±0.2 |
| D | 0.25±0.2 | 0.3±0.2 | 0.4±0.2 | 0.5±0.25 | 0.5±0.25 | 0.5±0.2 | 0.6±0.2 |
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If the rated voltage exceeds the maximum working voltage, use the maximum working voltage.
Electrical Characteristics
| Test Item | Requirement | Test Method |
|---|---|---|
| Temperature Coefficient | ±1%: 100 ppm/°C ±2%, ±5%: 200 ppm/°C | |
| Short-Time Overload | ±(1% + 0.05Ω) | 2.5× rated voltage or 2× limiting voltage, whichever is lower, 5 s |
| Load Life | ±(3% + 0.05Ω) | 70°C; rated voltage; 1.5 h ON / 0.5 h OFF |
| Temperature Cycling | ±(1% + 0.05Ω) | −55°C to +125°C, 5 cycles |
| Humidity Load | ±(3% + 0.05Ω) | 40°C, 95% RH; 1.5 h ON / 0.5 h OFF; 1,000 h |
| Solder Heat Resistance | ±(1% + 0.05Ω) | 255°C, 3 s |
| Solderability | Minimum 95% coverage | 255°C, 3 s |
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Technical Details
Load Derating Curve

- X axis:
- Ambient Temperature (°C)
- Y axis:
- Rated Power (%)
Product Structure
- 1. Marking
- 2. Protective layer
- 3. Inner protective
- 4. Resistive layer
- 5. Conductive layer
- 6. Side conductive
- 7. Barrier layer
- 8. Termination layer
- 9. Ceramic Substrate

Plastic (Embossed)
Paper (Punched)
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