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Alloy Chip Resistors

Size	0805	1206	2512 (2W)	2512 (3W)	4527
Rated Power	0.5W	1W	2W	3W	5W
Resistance Range	5–15mΩ	1–100mΩ	0.5–510mΩ	0.5–510mΩ	0.5–100mΩ
Max. Working Current	10A	20A	30A	40A	60A
Max. Overload Current	20A	40A	60A	80A	120A

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Code	0805	1206	2512 Large Electrode	2512 Small Electrode	4527
L	2.0±0.2	3.2±0.2	6.4±0.2	6.4±0.2	11.6±0.5
W	1.25±0.2	1.6±0.2	3.2±0.2	3.2±0.2	6.5±0.5
C	0.35±0.2	0.5±0.2	2.2±0.2	2.2±0.2	1.6±0.5
T	0.5±0.2	0.6±0.3	0.8±0.3	0.8±0.3	2±0.35

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If the rated voltage exceeds the maximum working voltage, use the maximum working voltage.

Construction: protective layer · solder layer · nickel layer · copper-plated layer · alloy element

Test Item	Requirement (R = initial resistance)	Test Method
Temperature Coefficient	±50 ppm/°C	Measure at 25°C (T1, R1) and 125°C (T2, R2); TCR=(R2−R1)/(R1×(T2−T1))×10⁶
Short-Time Overload	\|ΔR\| ≤ (1% × R) + 0.05mΩ	5× rated power, 5 s (R000: maximum current 200 A)
Insulation Resistance	>100 MΩ	Apply 100 VDC ±15 V between terminal and substrate for 60 s
Dielectric Withstand Voltage	No breakdown or flashover	Ramp AC voltage between terminal and substrate at approx. 100 V/s to the maximum overload voltage (RMS); hold for 60±5 s
Solderability	Minimum 95% terminal coverage	245±5°C solder bath, 2±0.5 s
Resistance to Soldering Heat	\|ΔR\| ≤ (0.5% × R) + 0.05mΩ	270±5°C solder bath, 10±1 s
Bending Test	\|ΔR\| ≤ (0.5% × R) + 0.05mΩ	Bending distance 2 mm, 60±5 s
Solvent Resistance	No visible damage	IPA, 23±5°C, immersion 10 h
High Temperature Exposure	\|ΔR\| ≤ (1.0% × R) + 0.05mΩ	170°C, 1,000 h
Low Temperature Exposure	\|ΔR\| ≤ (0.5% × R) + 0.05mΩ	−55°C, 1,000 h
Load Life	\|ΔR\| ≤ (1.0% × R) + 0.05mΩ	70°C; 1.5 h ON / 0.5 h OFF; 1,000 h
Damp Heat, Steady State	\|ΔR\| ≤ (1.0% × R) + 0.05mΩ	85±2°C, 85±3% RH; 1.5 h ON / 0.5 h OFF; 1,000 h